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    • Main cleanroom QNC 1701
      • Deposition
      • Lithography
      • Dry etch
      • Wet Benches
      • Characterization
    • Packaging Lab QNC 1706
      • Convection Cure Oven [Cureoven]
      • Dicing Saw [DISCO-saw]
      • Die Bonder [TRESKY-diebond]
      • Epoxy Dispenser [NORDSON-epoxy]
      • H2 Plasma Cleaner [LFC-plasmaclean]
      • Measurement Microscope [OLYMPUS-scope3]
      • Wirebonder: Manual Wedge/Ball [WESTBOND-wirebond1]
      • Wirebonder: Semi-automatic Wedge [WESTBOND-wirebond2]
      • Wire Pull Tester [WESTBOND-pulltest]
    • Sample prep lab QNC 1508
      • Contact Angle Goniometer [RAMEHART-contactangle]
      • Diamond Scriber [OEG-scriber]
      • Hood: Acids & Bases Chemical Processing [FUMEHOOD-south]
      • Hood: Solvents Chemical Processing [FUMEHOOD-north]
    • QNC TEM Labs (QNC B703, B709, B711)
      • B709: JEOL JEM-F200 S/TEM with EELS [JEOL-TEM]
      • B711: Zeiss Auriga 40 SEM/FIB [ZEISS-SEMFIB]
      • B703: TEM Sample Prep Lab
      • B703: Microscope [ZEISS-scope]
      • B703: Multi-Tool Sample Prep [LEICA-EMTXP]
      • B703: South Bay D500i Dimpler [SOUTHBAY-dimpler]
      • B703: South Bay 650 Saw [SOUTHBAY-saw]
      • B703: Leica RES102 Ion Mill [LEICA-ionmill]
      • B703: South Bay 900 Grinder/Polisher [SOUTHBAY-polish]
    • RAC1 Clean Assembly Lab (RAC 1013)
      • RAC1 Assembly Station 1 [AssemblyStation1-R1]
      • RAC1 Assembly Station 2 [AssemblyStation2-R1]
      • RAC1 Environmental Chamber [TESTEQUITY-TChamber-R1]
      • RAC1 Hood: HF Acids only [WB-HFACID-R1]
      • RAC1 Hood: Non-HF Acids & Bases [WB-ACIDBASEnonHF-R1]
      • RAC1 Hood: Solvent Processing [WB-SOLVENT-R1]
      • RAC1 Lapper [Lapper-R1]
      • RAC1 Laser Welder: [ROFIN-welder-R1]
      • RAC1 O2/Ar Plasma Cleaner [PLASMAETCH-plasmaclean-R1]
      • RAC1 Microscope #1 [MITUTOYO-scope-R1]
      • RAC1 Microscope #2 [EVOVISION-scope-R1]
      • RAC1 Microscope #3 [LEITZ-scope-R1]
      • RAC1 Sample Cutter [ALLIED-xtal-cut-R1]
      • RAC1 Wirebonder: Manual [WESTBOND-wirebond-R1]
      • RAC1 Wire Saw [WIRETEC-wire-saw-R1]
      • RAC1 Bruker Contour Profiler [BRUKER-contour-R1]
    • RAC1 Inert Lab
      • RAC1 Atomic Force Microscope [VEECO-AFM-R1]
      • Evaporator: thermal [Inert-AngstromEvap-R1]
      • Hood: Acids & Bases Chemical Processing [Inert-WB-Acidbase-R1]
      • Hood: Solvents Chemical Processing [Inert-WB-Solvents-R1]
    • RAC2 Satellite Labs
      • RAC2 Angstrom LPCVD [ANGSTROM-LPCVD-R2]
      • RAC2 Fiber Splicer [VYTRAN-splicer-R2]
      • RAC2 TSST Pulsed Laser Deposition [TSST-PLD-R2]
      • RAC2 1st Nano SiNW CVD [1stNANO-SiNW-R2]
  • News
    • Update to QNC Hours of Operation
    • COVID-19 training slides
    • QNFCF featured in Microscopy and Analysis Magazine
    • Special guests visit QNFCF
    • Now open to new members
    • Launch of new WCMS website
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Safety Policies

Title Type
Emergency Response Page
Emergency Contacts Page
COVID-19 Safety Page
Footwear, Clothing & other Guidelines Page
Contact Lenses Page
Personal Protective Equipment (PPE) Page
Buddy System Page
Pregnancy Page
Safety Concerns Page
Safe Use of Chemicals Page
Bringing Chemicals into QNFCF Labs Page
Piranha Solutions Page
TMAH Photoresist Developer Page
Video Recordings Page
TV Panels & Camera Feeds Page
General Safety Features Page
Limitations on Personal Device Use Page
Buddy System: Minor Exceptions Page
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    • Monthly use check
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    • Getting to the QNFCF
    • Sample equip training request
    • Sample SOP
    • Sample safety training
    • Equipment Trainers

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University of Waterloo
200 University Avenue West
Waterloo, Ontario
N2L 3G1, Canada
+1 519 888 4567

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