Deposition
Summary of available deposition equipment
| Title | Type | Image | |
|---|---|---|---|
| ALD/PECVD Cluster [OXFORD-cluster] | Folder | ||
| Evaporator: Al Superconducting films [PLASSYS-Ebeam] | Folder | ||
| Evaporator: E-beam [ANGSTROM-Ebeam] | Folder | ||
| Evaporator: E-beam & thermal [INTLVAC-Ebeam] | Folder | ||
| Evaporator: thermal [ANGSTROM-Thermal] | Folder | ||
| LPCVD LTO [TYSTAR4-LTO] | Folder | ||
| LPCVD Poly Si [TYSTAR3-PolySiC] | Folder | ||
| LPCVD Silicon Nitride [TYSTAR2-nitride] | Folder | ||
| Oxidation [TYSTAR1-atm] | Folder | ||
| Rapid Thermal Processor #1 [ALLWIN-RTP] | Folder | ||
| Rapid Thermal Processor #2 [ALLWIN-RTP2] | Folder | ||
| Sputter: Twin Chamber [AJA-sputter] | Folder |