• Log in
Plone site
  • Home
  • People
  • Governance
  • Policies
    • Safety Policies
    • Operating Policies
  • Equipment
    • Main cleanroom QNC 1701
      • Deposition
      • Lithography
      • Dry etch
      • Wet Benches
      • Characterization
    • Packaging Lab QNC 1706
      • Convection Cure Oven [Cureoven]
      • Dicing Saw [DISCO-saw]
      • Die Bonder [TRESKY-diebond]
      • Epoxy Dispenser [NORDSON-epoxy]
      • H2 Plasma Cleaner [LFC-plasmaclean]
      • Measurement Microscope [OLYMPUS-scope3]
      • Wirebonder: Manual Wedge/Ball [WESTBOND-wirebond1]
      • Wirebonder: Semi-automatic Wedge [WESTBOND-wirebond2]
      • Wire Pull Tester [WESTBOND-pulltest]
    • Sample prep lab QNC 1508
      • Contact Angle Goniometer [RAMEHART-contactangle]
      • Diamond Scriber [OEG-scriber]
      • Hood: Acids & Bases Chemical Processing [FUMEHOOD-south]
      • Hood: Solvents Chemical Processing [FUMEHOOD-north]
    • QNC Metrology
      • B709: JEOL JEM-F200 S/TEM with EELS [JEOL-TEM]
      • B711: Zeiss Auriga 40 SEM/FIB [ZEISS-SEMFIB]
      • B703: Gatan Tuned Piezo Cutter [GATAN-CUTTER]
      • B703: Microscope [ZEISS-scope]
      • B703: Multi-Tool Sample Prep [LEICA-EMTXP]
      • B703: South Bay D500i Dimpler [SOUTHBAY-dimpler]
      • B703: South Bay 650 Saw [SOUTHBAY-saw]
      • B703: Leica RES102 Ion Mill [LEICA-ionmill]
      • B703: South Bay 900 Grinder/Polisher [SOUTHBAY-polish]
    • RAC1 Clean Assembly Lab (RAC 1013)
      • RAC1 Assembly Station 1 [AssemblyStation1-R1]
      • RAC1 Assembly Station 2 [AssemblyStation2-R1]
      • RAC1 Environmental Chamber [TESTEQUITY-TChamber-R1]
      • RAC1 Hood: HF Acids only [WB-HFACID-R1]
      • RAC1 Hood: Non-HF Acids & Bases [WB-ACIDBASEnonHF-R1]
      • RAC1 Hood: Solvent Processing [WB-SOLVENT-R1]
      • RAC1 Lapper [Lapper-R1]
      • RAC1 Laser Welder: [ROFIN-welder-R1]
      • RAC1 O2/Ar Plasma Cleaner [PLASMAETCH-plasmaclean-R1]
      • RAC1 Microscope #1 [MITUTOYO-scope-R1]
      • RAC1 Microscope #2 [EVOVISION-scope-R1]
      • RAC1 Microscope #3 [LEITZ-scope-R1]
      • RAC1 Sample Cutter [ALLIED-xtal-cut-R1]
      • RAC1 Wirebonder: Manual [WESTBOND-wirebond-R1]
      • RAC1 Wire Saw [WIRETEC-wire-saw-R1]
      • RAC1 Bruker Contour Profiler [BRUKER-contour-R1]
    • RAC1 Inert Atmosphere Fabrication Lab
      • RAC1 Atomic Force Microscope [VEECO-AFM-R1]
      • Gloveboxed Thermal Evaporator [Inert-AngstromEvap-R1]
      • Hood: Acids & Bases Chemical Processing [Inert-WB-Acidbase-R1]
      • Hood: Solvents Chemical Processing [Inert-WB-Solvents-R1]
      • Gloveboxed Reactive Ion Etch [Inert-PLASMAETCH-RIE-R1]
    • RAC2 Satellite Labs
      • RAC2 Angstrom LPCVD [ANGSTROM-LPCVD-R2]
      • RAC2 Fiber Splicer [VYTRAN-splicer-R2]
      • RAC2 TSST Pulsed Laser Deposition [TSST-PLD-R2]
      • RAC2 1st Nano SiNW CVD [1stNANO-SiNW-R2]
      • RAC2 OMICRON Low-Temperature STM with QPlus AFM [OMICRON-LT-SPM]
      • RAC2 D8 Discover XRD [D8-VENTURE-XRD]
  • News
    • Update to QNC Hours of Operation
    • COVID-19 training slides
    • QNFCF featured in Microscopy and Analysis Magazine
    • Special guests visit QNFCF
    • Now open to new members
    • Launch of new WCMS website
Advanced Search…
  1. Home
  2. Data
  3. Photos
Photos https://qnfcf.uwaterloo.ca/data/photos https://qnfcf.uwaterloo.ca/@@site-logo/QNFCF.svg

Photos

Oxford ALD/PECVD
AJA Twin Chamber Sputter
Tystar 4-Tube Furnace
Intlvac Nanochrome II
Plassys Niobium Sputter
Raith 150TWO 30kV EBL
JEOL JBX-6300FS 100kV EBL
Suss MA6 Front/Back Aligner
AJA Ion Mill
Oxford Bosch Si Etch (Deep RIE)
Everbeing EB-8 Probe Station
Oxford Metals & III-V Etch RIE
Everbeing EB-8 Probe Station Shield Box
Angstrom Engineering Thermal Evaporator
Packaging Lab Layout
Navigation
  • Governance
  • Annual Reports
  • Lab Equipment
  • About the QNFCF
  • COVID-19
  • Photos
    • Oxford ALD/PECVD
    • AJA Twin Chamber Sputter
    • Tystar 4-Tube Furnace
    • Intlvac Nanochrome II
    • Plassys Niobium Sputter
    • Raith 150TWO 30kV EBL
    • JEOL JBX-6300FS 100kV EBL
    • Suss MA6 Front/Back Aligner
    • AJA Ion Mill
    • Oxford Bosch Si Etch (Deep RIE)
    • Everbeing EB-8 Probe Station
    • Oxford Metals & III-V Etch RIE
    • Everbeing EB-8 Probe Station Shield Box
    • Angstrom Engineering Thermal Evaporator
    • Packaging Lab Layout
  • General

Mailing Address
University of Waterloo
200 University Avenue West
Waterloo, Ontario
N2L 3G1, Canada
+1 519 888 4567
  • About Waterloo
  • Faculties & Academics
  • Offices & Services
  • Support Waterloo
  • Contact Waterloo
  • Maps & Directions
  • Media
  • Employment
  • Copyright
  • Privacy

  

  
  • Site Map
  • Accessibility
  • Contact