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    • Main cleanroom QNC 1701
      • Deposition
      • Lithography
      • Dry etch
      • Wet Benches
      • Characterization
    • Packaging Lab QNC 1706
      • Convection Cure Oven [Cureoven]
      • Dicing Saw [DISCO-saw]
      • Die Bonder [TRESKY-diebond]
      • Epoxy Dispenser [NORDSON-epoxy]
      • H2 Plasma Cleaner [LFC-plasmaclean]
      • Measurement Microscope [OLYMPUS-scope3]
      • Wirebonder: Manual Wedge/Ball [WESTBOND-wirebond1]
      • Wirebonder: Semi-automatic Wedge [WESTBOND-wirebond2]
      • Wire Pull Tester [WESTBOND-pulltest]
    • Sample prep lab QNC 1508
      • Contact Angle Goniometer [RAMEHART-contactangle]
      • Diamond Scriber [OEG-scriber]
      • Hood: Acids & Bases Chemical Processing [FUMEHOOD-south]
      • Hood: Solvents Chemical Processing [FUMEHOOD-north]
    • QNC Metrology
      • B709: JEOL JEM-F200 S/TEM with EELS [JEOL-TEM]
      • B711: Zeiss Auriga 40 SEM/FIB [ZEISS-SEMFIB]
      • B703: Gatan Tuned Piezo Cutter [GATAN-CUTTER]
      • B703: Microscope [ZEISS-scope]
      • B703: Multi-Tool Sample Prep [LEICA-EMTXP]
      • B703: South Bay D500i Dimpler [SOUTHBAY-dimpler]
      • B703: South Bay 650 Saw [SOUTHBAY-saw]
      • B703: Leica RES102 Ion Mill [LEICA-ionmill]
      • B703: South Bay 900 Grinder/Polisher [SOUTHBAY-polish]
    • RAC1 Clean Assembly Lab (RAC 1013)
      • RAC1 Assembly Station 1 [AssemblyStation1-R1]
      • RAC1 Assembly Station 2 [AssemblyStation2-R1]
      • RAC1 Environmental Chamber [TESTEQUITY-TChamber-R1]
      • RAC1 Hood: HF Acids only [WB-HFACID-R1]
      • RAC1 Hood: Non-HF Acids & Bases [WB-ACIDBASEnonHF-R1]
      • RAC1 Hood: Solvent Processing [WB-SOLVENT-R1]
      • RAC1 Lapper [Lapper-R1]
      • RAC1 Laser Welder: [ROFIN-welder-R1]
      • RAC1 O2/Ar Plasma Cleaner [PLASMAETCH-plasmaclean-R1]
      • RAC1 Microscope #1 [MITUTOYO-scope-R1]
      • RAC1 Microscope #2 [EVOVISION-scope-R1]
      • RAC1 Microscope #3 [LEITZ-scope-R1]
      • RAC1 Sample Cutter [ALLIED-xtal-cut-R1]
      • RAC1 Wirebonder: Manual [WESTBOND-wirebond-R1]
      • RAC1 Wire Saw [WIRETEC-wire-saw-R1]
      • RAC1 Bruker Contour Profiler [BRUKER-contour-R1]
    • RAC1 Inert Atmosphere Fabrication Lab
      • RAC1 Atomic Force Microscope [VEECO-AFM-R1]
      • Gloveboxed Thermal Evaporator [Inert-AngstromEvap-R1]
      • Hood: Acids & Bases Chemical Processing [Inert-WB-Acidbase-R1]
      • Hood: Solvents Chemical Processing [Inert-WB-Solvents-R1]
      • Gloveboxed Reactive Ion Etch [Inert-PLASMAETCH-RIE-R1]
    • RAC2 Satellite Labs
      • RAC2 Angstrom LPCVD [ANGSTROM-LPCVD-R2]
      • RAC2 Fiber Splicer [VYTRAN-splicer-R2]
      • RAC2 TSST Pulsed Laser Deposition [TSST-PLD-R2]
      • RAC2 1st Nano SiNW CVD [1stNANO-SiNW-R2]
      • RAC2 OMICRON Low-Temperature STM with QPlus AFM [OMICRON-LT-SPM]
      • RAC2 D8 Discover XRD [D8-VENTURE-XRD]
  • News
    • Update to QNC Hours of Operation
    • COVID-19 training slides
    • QNFCF featured in Microscopy and Analysis Magazine
    • Special guests visit QNFCF
    • Now open to new members
    • Launch of new WCMS website
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Forms

New Project Application & Account Authorization (online fillable)
New Project Application & Account Authorization (printable)
External Lab User Agreement
Lab Member Agreement (printable)
External Users: Assumption of Risk, Waiver and Indemnity Form
COVID screening questionnaire
Request for $50 credit
Characterization Service Request
Feasibility Consultation Required
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  • Forms
    • New Project Application & Account Authorization (online fillable)
    • New Project Application & Account Authorization (printable)
    • External Lab User Agreement
    • Lab Member Agreement (printable)
    • External Users: Assumption of Risk, Waiver and Indemnity Form
    • COVID screening questionnaire
    • Request for $50 credit
    • Characterization Service Request
  • Membership

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