General Info

Summary of system capabilities

Vendor:   Plasma Etch
Model:     PE100-RIE
Purpose:  This system is configured for Plasma cleaning of substrates and anisotropic reactive ion etching of SiO2.
System Features: 
  • Gases, O2, Ar, CHF3
  • 300Watts, 13.56 Mhz RF power supply and automatic RF matching unit
  • 0-50SCCM MFC
 

Important

  1. Material restrictions in effect: click here
  2. Training required prior to use: click here
  3. More info for lab members: Manuals and Processes

 

Oxygen and nitrogen plasma etching system