Authorized Materials

Summary of material constraints

Lab members wishing to introduce new materials into this system must first obtain authorization from staff. New material requests must be initiated by submitting a Process Review Request form.

Non compliance will result in loss of member privileges

 

Authorized Substrates & Thin Films

  • Silicon
  • alumina (Al2O3)
  • silicon nitride
  • silicon dioxide (films or fused silica substrates)
  • amorphous silicon and polysilicon
  • GaAs, InAs, GaN
  • thin films of:  Ti, Al, Ni, Cr, Au, Pt, Ge
  • photoresist, E-beam resist
  • cured PDMS (Gel-Pak and SYLGARD 182/184). All users are required to cure the SYLGARD PDMS at 100°C for 75 minutes minimum. Curing at lower temperatures and/or shorter durations is not permitted without written consent from Fab staff.
  • if any other materials are present on your samples, CONTACT STAFF BEFORE PROCEEDING

    PROHIBITED Films

    The possibility of introducing the following films has been studied. Our research has concluded that the risk of chamber contamination is too high. Thus, these materials are NOT ALLOWED in this system:
    • Zn
    • In
    • Sb
    • ZnSe
    • Se
    • Bi2Te3