General Info

Summary of system capabilities

Vendor:   West-Bond Inc.
Model:     4546E
Purpose:  Making electrical contacts between semiconductor dies and packages

Important

  1. Material restrictions in effect: click here
  2. Training required prior to use: click here
  3. More info for lab members: Manuals and Processes
The Westbond 4546E wirebonder is a semi-automatic wedge bond tool with microprocessor controllable motion in Z and Y axes. This tool uses ultrasonic energy to bond wire leads between wafer dies and contact pads of electronic packages. 
 
The 4546E is typically left configured for 25 micron Al wire (wedge bonding configuration).
 

 The wire bonder has the following specifications:

  • Z tool range:  0.5"
  • Z motion resolution (motorized): 0.0002"
  • Y tool range:  0.5"
  • Y motion resolution (motorized): 0.0002"
  • Bond force range: 10-250 grams
  • Ultrasonic transducer:  63kHz,  (Max power = 5W)
  • 1/2" wire spool
  • ESD protection
  • Tool radiant heat available
  • Various work holders
  • 45 degree wedge capability
    • Tool length = 0.750"
    • Wire range = 0.7 - 2.0 mils
  • 90 degree wedge capability
    • Tool length = 0.750"
    • Wire range = 0.7 - 2.0 mils
    • Ribbon capability up to 1x10mil gold ribbon