General Info

Summary of system capabilities

Vendor:   DISCO
Model:     DAD3240
Purpose:  Dicing of thin substrates into smaller pieces


  1. Material restrictions in effect: here
  2. Training required prior to use: here
  3. More info for lab members: Manuals and Processes

The Disco DAD3240 is a small footprint, 6” compatible automatic dicing saw. This tool is used to cut semiconductor wafers into individual chips or dies.