General Info

Summary of system capabilities

Vendor: SÜSS MicroTec
Model: MA6/BA6 aligner/exposure system with bottom-side alignment option
Purpose: Alignment and UV exposure of resist-coated wafers in MA mode, alignment of 2 susbtrates before bonding in BA mode

Important

  1. Material restrictions in effect: click here
  2. Training required prior to use: click here
  3. More info for lab members: Manuals and Processes

Light source

  • 350W broadband (250nm to 400nm)

Available Options

  • Enhanced Image Storage System (EISS) for precise alignment
  • Bottom-side alignment system for front-to-backside alignment via the use of a bottom-side split-field microscope coupled to two high resolution CCD cameras. The system is capable of 1um front-to-back alignment accuracy.
  • G-Line filter
  • UV400 filter

Available Chucks

  • "small pieces" glass chuck for proximity/contact/vacuum contact and back-side alignment (for 3" wafers, 2" wafers and pieces down to 10mm x 10mm)
  • 4 inch diameter wafer chuck for proximity/contact/vacuum contact and back-side alignment
  • 6 inch diameter wafer chuck for proximity/contact/vacuum contact and back-side alignment
  • 75 mm bond chuck for 75 mm wafers and pieces
  • 100 mm bond chuck

Available Mask Holders

  • Holder for 3.5" x 3.5" to 5" x 5" masks and for exposure of 3 inch diameter (or smaller) wafers
  • Holder for 5" x 5" and 6" x 6" masks and for exposure of 4 inch diameter (or smaller) wafers
  • Holder for 7" x 7" masks and for exposure of 6 inch diameter (or smaller) wafers