General Info

Summary of system capabilities

Vendor:   Heidelberg Instruments
Model:     MLA150 Direct Write UV Lithography system
Purpose:  Alignment and UV exposure of resist-coated wafers


  1. Material restrictions in effect: click here
  2. Training required prior to use: click here
  3. More info for lab members: Manuals and Processes

Light sources

  • 405nm laser (broadband resists)
  • 375nm laser (I-line resists)

Available Options

  • Backside alignment

Compatible Substrate Sizes

  • Minimum substrate size = 8mm x 8mm square
  • Maximum substrate size = 150mm x 150mm