General Info

Summary of system capabilities

Vendor: SÜSS MicroTec
Model: SB6 GEN2 Wafer Bonder with 550oC heating option
Purpose: Permanent bonding of two blank or patterned substrates


  1. Material restrictions in effect: click here
  2. Training required prior to use: click here
  3. More info for lab members: Manuals and Processes

Available Options

  • Up to 550oC heating
  • Anodic bonding (75 and 100 mm wafers only)
  • 500 N to 20 kN force
  • Turbopump for high vacuum operations (as low as 5e-5 mbar)

Available Tooling

  • Bond tooling for 100 mm and 75 mm wafers
  • Quartz clamping plate for pieces of 1 cm x 1 cm to 75 mm in diameter
  • Tooling to allow for 2-substrate pre-alignment and clamping (on SÜSS-MicroTec MA6 aligner) prior to permanent bonding (tooling available for 100mm and 75mm diameter wafers as smaller pieces)