General Info

Summary of system capabilities

Vendor:   Allwin21 Corp.
Model:     AccuThermo AW 610
Purpose:  Short duration, high-temperature processing of 4" or 6" wafers


  1. Material restrictions in effect: click here
  2. Training required prior to use: click here
  3. More info for lab members: Manuals and Processes 

The AW610 rapid thermal processing (RTP) system uses high intensity visible radiation to heat single wafers for short process periods of time (typically 10 minutes or less) at precisely controlled temperatures up to 800°C. The system is capable of annealing substrates in N2, Ar, O2 and forming gas environments. The system is a cold wall, quartz chamber, which is heated with top and bottom arrays of high intensity halogen lamps using a closed-loop temperature control using a thermocouple. Typical processes for this tool include metal-silicide formation and ohmic contact fomation.

Gases currently available on this system

  • N2
  • O2
  • Ar
  • H2/N2 5% (forming gas)

Additional Information

  • System is equipped to handle 3” – 6” wafers placed directly on the tray.
  • Single pocket 4” susceptor available for annealing III-V materials or IR transparent substrates.
  • Temperature control is performed only with a thermocouple.
  • Photoresist-coated wafers are strictly prohibited since the system supports high temperature processes which are not compatible with photoresist films.