Authorized Materials

Summary of material constraints

Lab members wishing to introduce new materials into this system must first obtain authorization from staff. New material requests must be initiated by submitting a Process Review Request form.

Non compliance will result in loss of member privileges

Authorized Substrates & Thin Films

  • Silicon wafers (prime, new, virgin of acceptable origin)
  • SOI wafers (prime, new, virgin of acceptable origin)
  • SiO2 thin film (with known & proven clean history)

Consultation with staff required before processing:

  • Some specific metal films including Ti, Au, Ni
  • GaAs: Proximity or PECVD capping layer required above 450oC
  • InP: Proximity or PECVD capping layer required above 450oC
  • InAs: Proximity or PECVD capping layer required above 450oC
  • GaN
  • HSQ, Medusa 82 and other spin-on-glasses (SOG)

PROHIBITED Substrates & Films

  • ZnSe
  • Se
  • Kapton tape
  • Cool grease
  • Photo and e-beam resist
  • Wax
  • Bi2Te3

Important Note on Cleanliness

Any preprocessed wafer exposed to organic material (photoresist, e-beam resist, wax, oil) or other material that can degrade and degas at high temperature must undergo a thorough wet or plasma cleaning before being introduced into this system. 

Additional Information

This system is configured to handle 4" diameter wafers with typical thickness of 550um (approx)