Authorized Materials

Summary of material constraints

Lab members wishing to introduce new materials into this system must first obtain authorization from staff. New material requests must be initiated by submitting a Process Review Request form.

Non compliance will result in loss of member privileges

Authorized Substrates & Thin Films

  • Silicon
  • SOI
  • SiO2

PROHIBITED Substrates & Films

  • ZnSe
  • Se
  • Kapton tape
  • Cool grease
  • Photoresist
  • Wax
  • Bi2Te3

Note on Cleanliness

Until further notice, all pre-processed wafers must undergo a full RCA cleaning before being introduced into this furnace tube. RCA cleaning is to be performed on the Diffusion Preclean Wetbench. If your process cannot tolerate an RCA clean, please submit an online Process Review Request with details of your process and constraints.

Additional Information

  • This system is configured to handle 4" diameter wafers with typical thickness of 550um (approx).
  • Photoresist-coated wafers are strictly prohibited since the system supports high temperature processes which are not compatible with photoresist films.