General Info

Summary of system capabilities

Vendor:   West-Bond Inc.
Model:     747677E
Purpose:  Making electrical contacts between semiconductor dies and packages

Important

  1. Material restrictions in effect: click here
  2. Training required prior to use: click here
  3. More info for lab members: Manuals and Processes

The Westbond 747677E wirebonder is a manual wirebond tool which is fully convertible to enable both wedge and ball bonding methods. This tool uses ultrasonic energy or heat to bond wire leads between wafer dies and contact pads of electronic packages. 

 The 747677E is typically left configured for 25 micron Au wire (ball bonding configuration). 

 The wire bonder has the following specifications:

  • Z tool range:  0.5625"
  • Z encoder resolution: 0.001"
  • Bond force range: 10-250 grams
  • Ultrasonic transducer:  63kHz,  (Max power = 4W)
  • 1/2" wire spool
  • ESD protection
  • Tool radiant heat available
  • Various work holders
  • Ball bonding capability
    • Capillary length = 0.625" or 0.750"
    • Ball fault detection available
    • Wire range = 0.7 - 2.0 mils
  • 45 degree wedge capability
    • Tool length = 0.750"
    • Wire range = 0.7 - 2.0 mils
  • 90 degree wedge capability
    • Tool length = 0.750"
    • Wire range = 0.7 - 2.0 mils
    • Ribbon capability up to 1x10mil gold ribbon