General Info

Summary of system capabilities

Vendor: Angstrom Engineering Inc.
Model: Nexdep System with Glove box
Purpose: PVD of thin films via resistive-heating thermal evaporation. Chamber is connected to a multi-glovebox assembly. Two options exists for loading samples into the system: path #1 is from air directly into the evaporation chamber; path #2 is from the inert atmosphere glovebox into the evaporation chamber.


  1. Material restrictions in effect: click here
  2. Training required prior to use: click here
  3. More info for lab members: Manuals and Processes

Available Options

  • Four thermal evaporation sources (via resistive heating)
  • Quartz heaters up to 300oC
  • Overnight (12hr pump down) base pressure of 5x10-7 Torr (from atmospheric conditions)

Film Types Available

  • Ti
  • Au
  • Pt
  • Pd
NOTE: due to crucible erosion issues depositions are limited to <3kA (rare exceptions granted on a case-by-case basis; consult with staff).

PROHIBITED depositions

The possibility of depositing the following films has been studied. Our research has concluded that the risk of chamber contamination is too high. Thus, these materials are NOT ALLOWED in this system:
  • Organics (all organics prohibited)
  • High vapour pressure soft materials are prohibited
  • Al
  • Bi (and any Bi alloy)
  • Bi2Te3
  • Cd (and any Cd alloy)
  • Cr
  • Fe (no magnetic materials permitted)
  • Ge
  • In
  • Sb
  • Se
  • Zn (and any Zn alloy)