General Info

Summary of system capabilities

Model:     Model 650 Saw
Purpose:  Precision grinding of sample disc prior to ion-beam milling


  1. Material restrictions in effect: click here
  2. Training required prior to use: click here
  3. More info for lab members: Manuals and Processes

The South Bay Technology Model 650 low speed diamond saw is used to downsize bulk samples to dimensions suitable for subsequent grinding and polishing methods.

Key features

  • Can be used with 3" or 4" diamond wafering blades (CBN, Al203 and SiC blades can also be used)
  • Both coarse and fine sample position adjustments allow rapid and accurate sample positioning.
  • Automatic termination of the cutting process is controlled by an electromechanical downstop which minimizes supervision.


Wheel Rotation: 0 - 300 RPM 
Wheel Diameter: 3" (75mm) & 4" (100mm)
Max Sample Diameter: 1.3" (33mm)
Specimen Load: 0 - 500 grams
Spindle Diameter: 0.5" (12.7mm)
Motor: 1/15 HP DC
Micrometer Feed: 0 - 1.000", .001" increments
0 - 25mm, 0.01mm increments