Lab members wishing to introduce new materials into this system must first obtain authorization from staff. New material requests must be initiated by submitting a Process Review Request form.
Non compliance will result in loss of member privileges
Authorized Substrates & Thin Films
Any hard, dry samples may be cut using this system.
For example:
- Single crystalline semiconductor wafers (e.g. silicon, III-V's, sapphire etc.)
- Metal and oxide thin films
- Glass and quartz
- Geological materials
- Ceramic materials
