Authorized Materials

Summary of material constraints

Lab members wishing to introduce new materials into this system must first obtain authorization from staff. New material requests must be initiated by submitting a Process Review Request form.

Non compliance will result in loss of member privileges

Authorized Materials

  • Silicon chips
  • III-V semiconductor chips such as GaAs, InP, etc.
  • Glass
  • Quartz
  • Fused silica
  • Diamond
  • Mother of Pearl
  • Metal films: Al, Au, Cr, Ti, Ni, Ge, Pt, Fe, Nb, NbN, NbTiN, Ag, Cu
  • Dielectric films (Al2O3, SiN, SiO2, TiO2)
  • Printed circuit boards
  • Integrated circuit packages
  • Substrates and packages that have been exposed to epoxies

PROHIBITED Materials

  • None identified to date. Check with staff before working with materials not listed above