General Info

Summary of system capabilities
Vendor:   Tresky
Model:     T-3000-FC3 Die Bonder
Purpose:  Bonding of semiconductor dies to packages


  1. Material restrictions in effect: here
  2. Training required prior to use: here
  3. More info for lab members: Manuals and Processes

The Tresky T-3000-FC3 die bonder enables bonding of semiconductor dies to packages through standard thermosonic bonding methods.  

The T-3000-FC3 is also capable of performing more complex “flip chip” type die bonding.  

A bonding force of up to 490 N (50 kg mass) may be applied at temperatures up to 400°C.  An ultrasonic transducer may also be employed for the purposes of bonding (100W at a static force of up to 340 N).