Authorized Materials

Summary of material constraints

Lab members wishing to introduce new materials into this system must first obtain authorization from staff. New material requests must be initiated by submitting a Process Review Request form.

Non compliance will result in loss of member privileges

Authorized Chemicals

  • Acetic acid
  • Hydrochloric acid
  • Nitric acid
  • Phosphoric acid
  • Sulfuric acid
  • Ammonium hydroxide
  • Hydrogen peroxide

Mixtures:

  • RCA 1and 2
  • HNA
  • Dilute aqua regia (< 200 mL)

Commercial solutions:

  • Al etchant type A and D
  • Gold atchant TFA
  • Nickel etchant
  • Palladum etchant TFP
  • Tantalum etchant  111
  • Tungsten etchant TFW
  • EKC265
  • Dynastrip DL9150

Authorized Substrates

  • silicon
  • III-V semiconductor materials such as GaAs, InP, etc.
  • glass
  • quartz
  • fused silica

Authorized Films

  • silicon dioxide
  • silicon nitride
  • polysilicon/amorphous silicon
  • aluminum
  • titanium
  • gold
  • chrome

PROHIBITED Substrates & Films

  • ZnSe
  • Se
  • Bi2Te3