Authorized Materials
Summary of material constraints
Lab members wishing to introduce new materials into this system must first obtain authorization from staff. New material requests must be initiated by submitting a Process Review Request form.
Non compliance will result in loss of member privileges
Authorized Substrates
- silicon
- III-V semiconductor materials such as GaAs, InP, etc.
- ZnSe
PROHIBITED Substrates
- FR-4 Circuitboard
- Any substrate not specifically authorized above is NOT PERMITTED
Authorized Films
- typical, fully baked, e-beam resists such as PMMA, ZEP, HSQ, etc.
- The table below represents minimum recommended baking times and temperatures for common resists. Baking at lower temperatures and/or shorter durations is not permitted without written consent from Fab staff.
- In order to ensure the consistency of baking temperature, all local users are required to bake their resist at the QNFCF.
| Resist | Temperature on hotplate (°C) | Duration (s) |
|---|---|---|
| PMMA | 180 | 180 |
| MMA(8.5)MAA copolymer | 150 | 180 |
| ZEP520A | 180 | 180 |
| AR-N 8200 | 150 | 600 |
- Resist stacks (multiple resists) must be baked at recommended conditions (or longer) following each individual spin step.
- Please consult Fab staff for resist stacks containing 3 or more component layers.
- Dielectric films: silicon dioxide, silicon nitride, Al2O3
- Chrome, aluminum, gold, titanium
- ZnSe
PROHIBITED Films
- Any film not specifically authorized above is NOT PERMITTED
- Any film not fully baked: remaining solvent will degas in the system and may trip off and damage the Schottky emitter.