Authorized Materials

Summary of material constraints

Lab members wishing to introduce new materials into this system must first obtain authorization from staff. New material requests must be initiated by submitting a Process Review Request form.

Non compliance will result in loss of member privileges

Authorized Substrates

  • silicon
  • quartz and fused silica (with limitations listed below; post process O2/SF6 clean required)
  • sapphire
  • III-V: InAs, GaAs

Authorized Films

  • all types of positive and negative optical and electron-beam photoresists (PMMA, ZEP, HSQ, Polystyrene)
  • Common metals: Al, Cr, Nb, Ta, W
  • Si and Si3N4
  • SiO2 (Note: Limited to 3um maximum film thickness; a oxygen cleaning recipe run is mandatory post-etch)
  • Metal oxide and nitrides: Al2O3, AlN, HfN, NbN, NbTiN, TiO2, TiN, ZnO
  • III-V: GaN, InGaAs, AlGaAs, InSb
  • Doped metal oxides: ITO, IGZO, AZO
  • 2D materials: graphene, h-BN
  • polyimide
  • Kapton tape (to cover defects, not on the whole wafer)

PROHIBITED Films

The possibility of introducing the following films has been studied. Our research has confirmed that the chamber contamination risk is too high. Therefore, these materials are NOT ALLOWED in this system:

  • YBCO (Yttrium Barium Copper Oxide)
  • Lithium niobate (LiNbO3) and other alkali compounds
  • Se and selenides
  • Any film not specifically authorized above is NOT PERMITTED (minor exception below)

Films which may be present but which must be fully masked (covered/encapsulated)

  • Thermal paste and Fomblin oil adhesives
  • Noble metals: Au, Pt
  • Magnetic metals: Ni