Authorized Materials

Summary of material constraints

Lab members wishing to introduce new materials into this system must first obtain authorization from staff. New material requests must be initiated by submitting a Process Review Request form.

Non compliance will result in loss of member privileges

Authorized substrates and thin films

  • Silicon wafers (prime, new, virgin of acceptable origin)
  • SOI wafers (prime, new, virgin of acceptable origin)
  • SiO2 thin film (with known and proven clean history)

Consultation with staff required before processing:

  • Some specific metal films including Ti, Au, Ni
  • GaAs: Proximity or PECVD capping layer required above 450oC
  • InP: Proximity or PECVD capping layer required above 450oC
  • InAs: Proximity or PECVD capping layer required above 450oC
  • GaN
  • HSQ, Medusa 82 and other spin-on-glasses (SOG)

PROHIBITED substrates and Films

  • ZnSe
  • Se
  • Kapton tape
  • Cool grease
  • All photoresists (UV and e-beam)
  • Wax
  • Bi2Te3

Important Note on Cleanliness

Any preprocessed wafer must undergo a full RCA cleaning before being introduced into this system. RCA cleaning is to be performed on the non-HF acid and base wetbench. If your process cannot tolerate an RCA clean, please submit an online Process Review Request with details of your process and constraints.

Additional Information

This system is configured to handle 4" diameter wafers with typical thickness of 550um (approx)