General Info

Summary of system capabilities

Vendor:   TOHO Technology
Model:     FLX-2320-R
Purpose:  Measuring thin film stress


  1. Material restrictions in effect: click here
  2. Training required prior to use: click here
  3. More info for lab members: Manuals and Processes

Tool Features

The TOHO FLX-2320-R is a tool for measuring wafer bowing due to stress imparted by deposited thin films. This tool is capable of measuring the wafer bowing of 3” 4” and 6” wafers and translating this value into a 3-D stress map.