General Info

Summary of system capabilities

Vendor:   LatticeGear
Model:     LatticeAx 225
Purpose:  Manual cleaving of substrates


  1. Material restrictions in effect: click here
  2. Training required prior to use: click here
  3. More info for lab members: Manuals and Processes

Tool Features

The LatticeAx 225 Manual Cleaving Tool makes it easier to downsize crystalline or amorphous samples without scribing the surface or dicing. 

The diamond indenter makes a   ~10 micron wide, 2 to 3 micron deep and <1 mm long clean surface microline which can be positioned to within 5 um using the attached microscope camera. This method has the benefit of creating a repeatable ‘weak point’ for sample cleaving and downsizing without the generation of particles. Careful calibriation of the indentation and cleaving force can be achieved in order to reliably produce clean 'mirror finish' flat edges, which are key to obtaining high quality crosssectional images of thin film structures using methods such as secondary electron microscopy and atomic force microscopy.