Authorized Materials

Summary of material constraints

Lab members wishing to introduce new materials into this system must first obtain authorization from staff. New material requests must be initiated by submitting a Process Review Request form.

Non compliance will result in loss of member privileges

Authorized Substrates & Thin Films

  • Silicon
  • III-V semiconductor materials such as GaAs, InP, etc.
  • ZnSe
  • Glass
  • Quartz
  • Fused silica
  • Films of positive and negative optical and electron-beam photoresists (no heating)
  • Metal films: Al, Au, Cr, Ti, Ni, Ge, Pt, Fe (Fe films allowed, deposition disallowed)
  • Films of Alumina and sapphire
  • Films of Silicon oxide and nitride
  • Polyimide

    PROHIBITED Films on substrate

    The possibility of introducing substrates coated with the following films has been studied. Our research has confirmed that the chamber contamination risk is too high. Therefore, these materials are NOT ALLOWED in this system:
    • In
    • Sb
    • Fe (films are allowed, deposition disallowed)
    • Zn
    • Se

    Films which may be present but ONLY under limited conditions

    • Bi2Te3:
      1. Thin films of Bi2Te3 may be present on your substrate but NO substrate heating is permitted while your substrate is in the chamber!
      2. Only room-temperate depositions are permitted in the Angstrom Amod system on substrates which have been previously coated with Bi2Te3.
      3. Bi2Te3 thin film depositions are NOT permitted in this system.